? semiconductor components industries, llc, 2012 july, 2012 ? rev. 1 1 publication order number: nlx2g32/d nlx2g32 dual 2-input or gate the nlx2g32 is a high performance dual 2 ? input or gate operating from a 1.65 v to 5.5 v supply. features ? extremely high speed: t pd 2.5 ns (typical) at v cc = 5 v ? designed for 1.65 v to 5.5 v v cc operation ? over voltage tolerant inputs ? lvttl compatible ? interface capability with 5 v ttl logic with v cc = 3 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements ? replacement for nc7wz32 ? chip complexity: fet = 120 ? these are pb ? free devices a2 y2 figure 1. pinout figure 2. logic symbol 1 y1 a1 b2 b1 v cc a1 b1 gnd 1 2 3 8 7 6 45 y2 y1 b2 a2 pin assignment pin 1 2 3 4 5 6 7 8 function a1 b1 y2 gnd a2 b2 y1 v cc input function table b l h l h output y = a + b y l h h h a l l h h ieee/iec see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information http://onsemi.com marking diagrams xx = specific device code m = date code = pb ? free package 1 ullga8 1.45 x 1.0 case 613aa 1 ullga8 1.6 x 1.0 case 613ab 1 ullga8 1.95 x 1.0 case 613ac ym atm atm udfn8 1.45 x 1.0 case 517bz udfn8 1.6 x 1.0 case 517by udfn8 1.95 x 1.0 case 517ca x m 1 x m 1 x m 1
nlx2g32 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage 0.5 to 7.0 v v i dc input voltage 0.5 to 7.0 v v o dc output voltage 0.5 to 7.0 v i ik dc input diode current v i < gnd 50 ma i ok dc output diode current v o < gnd 50 ma i o dc output sink current 50 ma i cc dc supply current per supply pin 100 ma i gnd dc ground current per ground pin 100 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance (note 1) 250 c/w p d power dissipation in still air at 85 c 250 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) > 2000 > 200 n/a v i latch ? up latch ? up performance above v cc and below gnd at 85 c (note 5) 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ? ounce copper trace with no air flow. 2. tested to eia/jesd22 ? a114 ? a. 3. tested to eia/jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc supply voltage operating data retention only 1.65 1.5 5.5 5.5 v v i input voltage (note 6) 0 5.5 v v o output voltage (high or low state) 0 v cc v t a operating free ? air temperature 40 85 c t/ v input transition rise or fall rate v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v 0 0 0 0 20 20 10 5 ns/v 6. unused inputs may not be left open. all inputs must be tied to a high ? logic voltage level or a low ? logic input voltage level.
nlx2g32 http://onsemi.com 3 dc electrical characteristics symbol parameter condition v cc (v) t a = +25 c t a = ? 40 c to +85 c unit min typ max min max v ih high level input voltage 1.65 to 1.95 0.75 v cc 0.7 v cc 0.75 v cc 0.7 v cc v v il low level input voltage 1.65 to 1.95 2.3 to 5.5 0.3 v cc 0.3 v cc v v oh high level output voltage v in = v ih i oh = ? 100 a 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 v i oh = ? 4 ma i oh = ? 8 ma i oh = ? 16 ma i oh = ? 24 ma i oh = ? 32 ma 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.8 2.68 4.2 1.20 1.9 2.4 2.3 3.8 v ol low ? level output voltage v in = v il i ol = 100 a 1.65 2.3 3.0 4.5 0 0 0 0 0.1 0.1 0.1 0.1 v i oh = 4 ma i oh = 8 ma i oh = 16 ma i oh = 24 ma i oh = 32 ma 1.65 2.3 3.0 3.0 4.5 0.08 0.1 0.15 0.22 0.22 0.24 0.3 0.4 0.55 0.55 i in input leakage current v in = v cc or gnd 0 to 5.5 0.1 1.0 a i off power off leakage cur- rent v in or v out = 5.5 v 0.0 1.0 10 i cc quiescent supply current v in = v cc or gnd 5.5 1.0 10 a ac electrical characteristics t r = t f = 3.0 ns v cc t a = 25 c 40 c t a 85 c symbol parameter condition (v) min typ max min max unit t plh propagation delay (figure 3 and 4) r l = 1 m c l = 15 pf 1.8 0.15 2.5 0.2 2.0 1.0 8.0 3.5 9.5 5.8 2.0 1.0 10.5 6.2 ns t phl r l = 1 m c l = 15 pf 3.3 0.3 0.8 2.6 3.9 0.8 4.3 r l = 500 c l = 50 pf 1.2 3.2 4.8 1.2 5.2 r l = 1 m c l = 15 pf 5.0 0.5 0.5 1.9 3.1 0.5 3.3 r l = 500 c l = 50 pf 0.8 2.5 3.7 0.8 4.0 capacitive characteristics symbol parameter condition typical unit c in input capacitance v cc = 5.5 v, v i = 0 v or v cc 2.5 pf c pd power dissipation capacitance (note 7) 10 mhz, v cc = 3.3 v, v i = 0 v or v cc 9 pf 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 11 7. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nlx2g32 http://onsemi.com 4 figure 3. switching waveform input r l c l a 1 ? mhz square input wave is recommended for propagation delay tests. figure 4. test circuit t f = 3 ns v cc gnd v oh v ol 90% 50% 10% 50% t plh t phl output y input a and b t f = 3 ns 90% 50% 10% 50% output device ordering information device order number package type tape and reel size ? nlx2g32amx1tcg ullga, 1.95x1 (pb ? free) 178 mm, 3000 units / tape & reel nlx2g32bmx1tcg ullga, 1.6x1 (pb ? free) 178 mm, 3000 units / tape & reel nlx2g32cmx1tcg ullga, 1.45x1 (pb ? free) 178 mm, 3000 units / tape & reel nlx2g32dmutcg udfn8, 1.95 x 1.0, 0.5p (pb ? free) 3000 units / tape & reel nlx2g32emutcg udfn8, 1.6 x 1.0, 0.4p (pb ? free) 3000 units / tape & reel NLX2G32FMUTCG udfn8, 1.45 x 1.0, 0.35p (pb ? free) 3000 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nlx2g32 http://onsemi.com 5 package dimensions udfn8 1.6x1.0, 0.4p case 517by issue o ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.60 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 8x l 7x l1 1 4 5 8 e/2 0.10 b 0.05 a c c note 3 m m dimensions: millimeters 0.26 7x 0.49 8x 1.24 0.53 pitch 0.40 1 pkg outline
nlx2g32 http://onsemi.com 6 package dimensions udfn8 1.45x1.0, 0.35p case 517bz issue o ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 8x l 7x l1 1 4 5 8 e/2 dimensions: millimeters 0.22 7x 0.48 8x 1.18 0.53 pitch 0.35 1 pkg outline 0.10 b 0.05 a c c note 3 m m
nlx2g32 http://onsemi.com 7 package dimensions udfn8 1.95x1.0, 0.5p case 517ca issue o ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.95 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 8x l 7x l1 1 4 5 8 e/2 dimensions: millimeters 0.30 7x 0.49 8x 1.24 0.54 pitch 0.50 1 pkg outline 0.10 b 0.05 a c c note 3 m m
nlx2g32 http://onsemi.com 8 package dimensions ullga8 1.45x1.0, 0.35p case 613aa issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.22 7x 0.48 8x 1.18 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
nlx2g32 http://onsemi.com 9 package dimensions ullga8 1.6x1.0, 0.4p case 613ab issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.60 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.26 7x 0.49 8x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.40 1 mounting footprint pkg outline
nlx2g32 http://onsemi.com 10 package dimensions ullga8 1.95x1.0, 0.5p case 613ac issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.95 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.30 7x 0.49 8x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nlx2g32/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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